In many applications with high-performance FPGAs power dissipation occurs (>30W) but yet there is very little space above the chip to ensure adequate cooling. The existing space must therefore be used as effectively as possible. In this case pin-fin heat sinks known as Kühligel® that are only 10 mm high together with a radial fan provide a cooling solution with a sensationally low thermal resistance of 0.95 K/W.
The distinguishing features of the pin-fin heat sink „Kühligel®“ are its low production costs and high effectivity, the same applies to the renowned blower HY60Q05P. This is supplied with a tacho, PWM input and the long-lasting Magfix bearing technology. The heat sinks can be adapted in all parameters (size, pin space, thickness of the base plate, height of the pins) whereby it is important to reach the right compromise between the longest possible pins and a base plate that is not too thin. The base plate not only acts as a support for the pins and should therefore not bend easily, but it is also the heat spreader that draws the heat into the surface and thus distributes it over a wide area. In other words: the larger the surface, the better the cooling effect.
SEPA EUROPE specializes in customized ideas for these type of cooling solutions. With over 25 years of experience, we can provide our customers with the right solution for virtually every task.